******Die-to-Wafer键合系统： EVG320 D2W 混合键合面激活和清洁系统详细介绍

EVG320 D2W  混合键合面激活和清洁系统

EVG?320 D2W   Automated Die Preparation and Activation System

EVG320 D2W 是一个高度灵活的平台，具有通用的硬件/软件界面，可与第三方选择和放置模具粘接系统实现无缝集成。它还可根据集成和线平衡要求作为独立系统运行。该系统融合了 EVG ***的清洁和等离子激活技术，可在其行业标准的 W2W 融合和混合粘结平台上使用，并已在全球数百个安装模块中得到验证。此外，EVG320 D2W 还配备了 EVG 的对齐验证模块 （AVM），这是一个集成的计量模块，可直接反馈模具粘结器的关键过程参数，如模具放置精度和模具高度信息以及粘结后计量，以改进过程控制。它还具有灵活的基板处理功能，可容纳任何类型的模具载体或薄膜框架，可支持等离子激活、混合和融合粘合清洁度标准以及 SECS/GEM 标准支持。

特征

最多六个过程模块

全自动盒式到盒式磁带或从 FOUP 到 FOUP 处理

通用模具载体输入，包括胶片框架和定制载体格式

通用硬件/软件界面，实现与第三方选点模具粘接系统的无缝集成

融合和混合结合的行业标准清洁和激活模块

计量模块允许进给转发和反馈回路来托管和连接拾取和放置模具粘合系统

GEMINI?FB  自动化集体晶圆对晶圆接合系统

GEMINI? FB   Automated Collective Die-to-Wafer Bonding System

高容量生产系统集体die-to-wafer (Co-D2W)键

特性

一个有前途的方法混合D2W结合集体D2W (Co-D2W)。 在Co-D2W结合,多个模具转移到最终的晶片在一个处理步骤。 制造流Co-D2W焊接过程由四个主要部分:载体制备、载体的人口,晶片键合和载体分离。 EVG GEMINI FB配置为D2W Co-D2W集成流中键是一个决定性的元素,使***清洁和载体的转移安装模具,焊接和载波分离系统。 GEMINI FB系统行业标准对薄片以及Co-D2W融合和混合成键。

特性

灵活的处理晶片和运营商定制的死亡

行业标准SmartView?NT面对面债券对准器载波设备晶片对齐

六预处理模块:

清洁模块

LowTemp?等离子体活化模块

校准验证模块

热压键模块

XT框架概念与EFEM吞吐量(设备前端模块)

EVG?320 D2W

Automated Die Preparation and Activation System

Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) die-to-wafer (D2W) bonding.

Features

The EVG320 D2W is a highly flexible platform that features a universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems. It also can operate as a stand-alone system depending on integration and line balancing requirements. The system incorporates EVG’s advanced cleaning and plasma activation technology, which is available across its industry-standard W2W fusion and hybrid bonding platforms and has been proven in hundreds of installed modules worldwide. In addition, the EVG320 D2W features EVG’s alignment verification module (AVM), an integrated metrology module that provides direct feedback to the die bonder on critical process parameters, such as die placement accuracy and die-height information as well as post-bond metrology, for improved process control. It also features flexible substrate handling that can accommodate any type of die carrier or film frame that can support plasma activation, hybrid and fusion bonding cleanliness standards, and SECS/GEM standard support.

Features

Up to six process modules

Fully automated cassette-to-cassette or FOUP-to-FOUP handling

Universal die carrier input including film frame and customized carrier formats

Universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems

Industry standard cleaning and activation modules for fusion and hybrid bonding

Metrology modules allowing feed-forward and feed-back loop to host and connected pick-and-place die bonding systems

GEMINI? FB

Automated Collective Die-to-Wafer Bonding System

High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding

Features

A promising approach for hybrid D2W bonding is collective D2W (Co-D2W). In Co-D2W bonding, multiple dies are transferred to the final wafer in a single process step. The manufacturing flow for the Co-D2W bonding process consist of four major segments: carrier preparation, carrier population, wafer bonding and carrier separation. The EVG Gemini FB configured for D2W bonding is a decisive element in the Co-D2W integration flow, enabling efficient cleaning and transfer of carrier mounted dies, bonding and carrier detachment in one system. The Gemini FB system is industry standard for both wafer-to-wafer as well as Co-D2W fusion and hybrid bonding.

Features

Flexible handling of wafer and customized die carriers

Industry standard SmartView? NT face-to-face bond aligner for carrier to device wafer alignment

Up to six pre-processing modules:

Clean module

LowTemp? plasma activation module

Alignment verification module

Thermocompression bond module

XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)

Software interfaces and integrated metrology functions allowing feed-forward and feed-back loop for efficient D2W overlay optimization